University of Illinois team stacks three active silicon layers on a single chip, achieving 98-100% transistor yield
Forward-looking: For years, the chip industry has chased better performance by shrinking transistors and squeezing more of them onto a flat slice of silicon. That strategy is running into hard limits. A group at the University of Illinois thinks the next gains will come not from going smaller, but from going vertical.
100Gbps-class wireless communication could be the next big thing
Looking ahead: Researchers at Japan's Tokushima University, the University of Tokyo, and Gifu University have developed a terahertz wireless communication system capable of transmitting data at 112Gbps in the 560GHz band. This is significantly faster than the few-gigabit-per-second data rates typically achieved by conventional terahertz communication systems operating at similar frequencies.