Tsmc articles

tsmc arizona anti-american temu lawsuit tsmc arizona

TSMC Arizona lawsuit alleges anti-American discrimination, racist remarks, buttock slapping, and Temu safety harnesses

"Americans are lazy, they don't work hard enough, they don't know enough, and they don't know commitment"
WTF?! A class action lawsuit against TSMC over allegations that the company discriminates against American workers while favoring those from Taiwan has been refiled to include over 30 plaintiffs. The suit claims that an anti-American bias exists at the semiconductor giant, and that non-Asian employees were called "stupid" or "lazy." One plaintiff said he heard Taiwanese employees say that "Black people are lazy and smell."
intel apple nvidia tsmc rumor leak intel 18a

Intel may scrap 18A node in favor of 14A to attract Apple and Nvidia

New CEO distances company from Gelsinger's 18A legacy, could lead to billion-dollar write-off
TL;DR: Intel CEO Lip-Bu Tan is reportedly considering scrapping the company's 18A manufacturing process for external foundry customers. Instead, Tan wants Team Blue to focus on the newer and more efficient 14A node in hopes of securing major clients like Apple and Nvidia away from TSMC.
trump tsmc semiconductor tariffs donald trump wafer

TSMC's 2nm wafer prices hit $30,000 as SRAM yields reportedly hit 90%

Apple, Intel, Nvidia, and others line up for next-gen chips
In context: TSMC has steadily raised the prices of its most advanced semiconductor process nodes over the past several years – so much so that one analysis suggests the cost per transistor hasn't decreased in over a decade. Further price hikes, driven by tariffs and rising development costs, are reinforcing the notion that Moore's Law is truly dead.
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TSMC unveils plans for giant AI chips to meet surging compute demands

The big picture: The semiconductor industry is approaching a significant milestone as TSMC prepares to expand the physical scale of its chip packaging technology. At its recent North American Technology Symposium, the company detailed plans for a new generation of CoWoS (Chip-on-Wafer-on-Substrate) technology, enabling the assembly of multi-chiplet processors much larger than those currently in production.